Samsung Electronics has confirmed (info) that the upcoming Galaxy Z Flip FE and Z Flip 7 will feature the new Exynos 2500 chipset. This marks a shift toward using Samsung’s own chip in its foldables, after relying on Qualcomm’s Snapdragon chips for years.
The Exynos 2500, built on Samsung’s 3nm gate-all-around (GAA) process, faced production delays due to low yields in the company’s foundry division. Initially planned for the Galaxy S25 series, the chip will not be ready in time for flagship devices, which will continue to use Qualcomm’s Snapdragon 8, produced by TSMC’s 3nm process.
Despite challenges, Samsung recently stabilized the 3nm GAA process, enabling the Exynos 2500 to be featured in future foldables. Senior officials confirmed that while the Exynos 2500 won’t appear in the Galaxy S25, it will be included in premium models of the Z Flip series.
This move shows Samsung’s attempts at bringing back share in this market for mobile chipsets. The company hopes to address the manufacturing issues through enhanced System LSI and Foundrys’ integration. Nevertheless, the key reliance on Qualcomm for flagship requires the Exynos 2500 might still need some time to scale up before it can match against the leaders.
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