TSMC in Hsinchu, Taiwan, just hit a major milestone. Their trial production for the 2-nanometer process is showing yields above 60%. This is impressive and goes beyond what the industry was expecting. According to sources within the semiconductor supply chain, as reported by LibertyTimes, TSMC’s 2nm process will enter mass production as scheduled in 2025, marking another milestone for the company’s industry leadership, especially in AI chip manufacturing.
TSMC’s new 2nm technology is a game-changer. It’s built on a groundbreaking nanosheet architecture, which is a huge step up from the 3nm FinFET technology we’re using now.The company has begun trial production at its Hsinchu Baoshan facility, which will soon transition to mass production at the Kaohsiung plant. Even though TSMC has not reported the actual trial production yield rate to the public yet, the encouraging events suggest that the company is on pace to deliver the most cutting-edge semiconductor technology by 2025.
As the semiconductor industry faces increasing demand for AI chips, TSMC is positioning itself as a key player in the sector. The company, which currently manufactures 99% of the world’s AI-related chips, has noted an unprecedented demand for its 2nm process. TSMC’s chairman, Wei Zhejia, emphasized that the demand for 2nm chips has exceeded all expectations, with AI-related customers eager to adopt the new technology.
Compared to this, other competitors such as Samsung and Intel are also developing their enhanced semiconductor architectures. While Samsung in development of its multi-bridge field-effect transistor (MBCFET) for 3nm process, they have not come to mass production. For its part, Intel’s 18A process is not yet out yet.
It is certain that TSMC will remain a semiconductor foundry market leader and its 2nm process will further consolidate its position as a world chipmaker.
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